教授簡介
1. P.H. Chen, H. Wang, K. Li, C.M. Wang, C.Y. Liu, Albert T. Wu* (2025, Aug). Sintering of Cu Nanoparticles for Optimized Particle Size and Enhanced Interconnect Performance. Journal of the Taiwan Institute of Chemical Engineers.
2. S.W. Pak, H. Tatsumi, J. Wang, Albert T. Wu, H. Nishikawa (2025, Apr). Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging. Intermetallics, 179, 108686.
3. W.T. Lin, K. Li, K.S. Lin, C.M. Wang, Albert T. Wu* (2025, Mar). Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy. JOM 77, 4215–4225.
4. Albert T. Wu*, H. Wang, P.H. Chen, K. Li, C.M. Wang, W. Tseng (2024, Oct). Advancing Bonding Techniques for Electronic Interconnects: Eco-Friendly Cu Nanoparticles and Cu-SAC Hybrid Paste.
5. C.H. Kung, J.Y. Huang, K.W. Cheng, C.H. Ku, Q.M. Huang, V. K. Ranganayakulu, Y.Y. Chen, Y.G. Lin, S.J. Chiu, Albert T. Wu* (2024, Sep). Enhancing performance and thermal stability in GeTe thermoelectric joints with cobalt diffusion barrier. Materials Chemistry and Physics, 323, 129649.
6. H. Wang, P.H. Chen, C.H. Kung, P.K. Chang, S.J. Chiu, Y.G. Lin, C.M. Wang, Albert T. Wu* (2024, Aug). Enhancement of Cu-to-Cu bonding property by residual stress in Cu substrate. Materials Characterization, 214, 114107.
7. Albert T. Wu*, W. Tseng, C.M. Wang, W.T. Lin (2024, May). Develop new solder alloy for high reliability device. In 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (pp. 1144-1147). IEEE.
8. Albert T. Wu*, T.H. Sheng, J.L. Chao, C.M. Wang, W. Tseng (2024, Apr). Cu Nanoparticle Sintering by Electrical Current. In 2024 International Conference on Electronics Packaging (ICEP) (pp. 107-108). IEEE.
9. K.W. Cheng, C.H. Kung, J.Y. Huang, C.H. Ku, Q.M. Huang, V.K. Ranganayakulu, Y.Y. Chen, S.J. Chiu, Y.G. Lin, C.M. Wang, Albert T. Wu* (2024, May). Preventing degradation of thermoelectric property after aging for Bi2Te3 thin film module. Materials Chemistry and Physics, 318, 129208.
10. AT Wu, C.C. Chang, T.C. Huang, Y.C. Chen, K. City, C.M. Wang (2023, Oct). Microstructure Modification for SnBi Low Temperature Solder Alloy.
11. T.H. Shen, K.W. Cheng, H. Wang, P.H. Chen, J.L. Chao, J.Y. Huang, C.M. Wang, Albert T. Wu* (2023, June). Electrical current enhanced sintering without Joule heating for Cu nanoparticles at room temperature. Materialia, 101821.
12. K.W. Cheng, Z.W. Sun, C.H. Kung, J.Y. Huang, T.H. Shen, V. K. Ranganayakulu, Y.Y. Chen, S.J. Chiu, Y.G. Lin, C.M. Wang, Albert T. Wu* (2023, June). Mitigation of Power Factor Degradation in Bi2Te3 Thin Films. ACS Applied Engineering Materials.
13. Albert T. Wu*, J.L. Chao, Y.Y. Lai, C.M. Wang(2023, Apr). Hybrid SnBi/SAC Low-Temperature Solder Bump. In 2023 International Conference on Electronics Packaging (ICEP) (pp. 213-214). IEEE.
14. J.L. Chao, S.W. Lin, J.C. Lin, Y.H. Liu, C.Y. Hsiao, F. Wang, Nico Li, Albert T. Wu* (2023, Mar). The effect of microstructure for Ni-based surface finishing thin film on corrosion behavior. Surface and Coatings Technology, 456, 129252.
15. Y.Y. Lai, J.L. Chao, C.J. Hsu, C.M. Wang, Albert T. Wu* (2023, Feb). Hybrid Solder Joint for Low-Temperature Bonding Application. Journal of Electronic Materials, 52(2), 782-791.
16. S.W. Lin, J.L. Chao, S.C. Ku, Nico Li, Albert T. Wu* (2022, Sep). Corrosion behaviors of Co, Co/Pd, and Co/Pd/Au surface finishes. Journal of the Taiwan Institute of Chemical Engineers, 138, 104480.
17. Z.W. Sun, K.W. Cheng, S.W. Lin, V. K. Ranganayakulu, Y.Y. Chen, S.J. Chiu, T.W. Lee, Albert T. Wu* (2022, Jun). Stoichiometric Effect of Sb2Te3 Thin Film on Thermoelectric Property. ACS Applied Energy Materials, 5, 6, 7026–7033.
18. K.S. Huang, T.H. Shen, W. Liu, J.L. Chao, Albert T. Wu* (2021, Nov). Novel solid-state pressureless approach for Cu-embedded intermetallic interconnects at low temperature. Materials Chemistry and Physics, 272, 124966.
19. W. Liu, H. Wang, K.S. Huang, C.M. Wang, Albert T. Wu* (2021, Jun). Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles. Journal of the Taiwan Institute of Chemical Engineers, 125, 394-401.
20. Y.H. Liao, C.H. Chen, C.L. Liang*, K.L. Lin, Albert T. Wu* (2020, Nov). A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property. Acta Materialia, 200, 200-210.
21. Chun-Hsien Wang, Hsien-Chien Hsieh, Zhen-Wei Sun, V. K. Ranganayakulu, Tian-Wey Lan, Yang-Yuan Chen, Ying-Yi Chang, and Albert T. Wu* (2020, May). Interfacial stability in Bi2Te3 thermoelectric joints. ACS Appl. Mater. Interfaces, 12, 27001–27009.
22. Hsien-Chien Hsieh, Chun-Hsien Wang, Tian-Wey Lan, Tse-Hsiao Lee, Yang-Yuan Chen, Hsu-Shen Chu, Albert T. Wu* (2020, May). Joint properties enhancement for PbTe thermoelectric materials by addition of diffusion barrier. Materials Chemistry and Physics, 246, 122848.
23. C.M. Wang, H.C. Chen, R.Y. Sheng, C.Y. Chen, Albert T. Wu, C. Chen, Y.H. Zhong (2020, Feb). Liquid composition.
24. Z. Zhang, C. Chen, Albert T. Wu, K. Suganuma (2019, Nov). Improvement of high-temperature thermal aging reliability of Ag–Au joints by modifying Ni/Au surface finish. Journal of Materials Science: Materials in Electronics, 30, 20292-20301.
25. W.C. Lin, T.H. Tseng, W. Liu, K.S. Huang, H. Chen, H.Y. Lee, C.S. Ku, Albert T. Wu* (2019, Sep). Effect of Sn Film Grain Size and Thickness on Kinetics of Spontaneous Sn Whisker Growth, JOM, 71(9) 3041-3048
26. T.H. Tseng, Albert T. Wu* (2019, Jul). Corrosion on automobile printed circuit broad. Microelectronics Reliability, 98, 19-23
27. Tsan-Hsien Tseng, Chih-Han Yang, Jeng-Yu Chiang, Jyun-Jhe Huang, Chih-Hao Chen, Shih-Kang Lin, Chang-Meng Wang, Albert T. Wu* (2019, June). Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates. Materials Science and Engineering: A, 759, 506-513.
28. Chun-Hsien Wang, Hsien-Chien Hsieh, Hsin-Yi Lee, Albert T. Wu* (2018, Oct). Co-P diffusion barrier for p-Bi2Te3 thermoelectric material. Journal of Electronic Materials, 48, 53-57.
29. T.H. Tseng, Albert T. Wu* (2018, Oct). Corrosion Resistance of Surface Finishes for High Reliability Devices. In 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (pp. 206-209). IEEE.
30. P.C. Lin, H. Chen, H.C. Hsieh, T.H. Tseng, H.Y. Lee, Albert T. Wu* (2018, Jun). Co-sputtered Cu (Ti) thin alloy film for formation of Cu diffusion and chip-level bonding. Materials Chemistry and Physics, 211, 17-22.
31. Albert T. Wu*, C.H. Chen, J.J. Huang, J.Y. Chiang, C.M. Wang (2018, Apr). Development of low temperature solder alloys for advanced electronic packaging: Assessment of In-Bi alloys on Cu substrates. In 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (pp. 128-131). IEEE.
32. H. Wu, Albert T. Wu, P. Wei, S. Chen (2018, Apr). Interfacial reactions in thermoelectric modules. Materials Research Letters, 6(4), 244-248.
33. W.C. Lin, Y.S. Li, Albert T. Wu* (2018, Jan). Study of diffusion barrier for solder/n-Type Bi2Te3 and bonding strength for p- and n-type thermoelectric modules. Journal of Electronic Materials, 47(1), 148-154.
34. B.C. Lin, C.S. Ku, H.Y. Lee, S. Chakroborty, Albert T. Wu* (2017, Dec). Analysis of arrayed nanocapacitor formed on nanorods by flow-rate interruption atomic layer deposition. Applied Surface Science, 426, 224-228.
35. C.H. Chen, S. Chakroborty, B.H. Lee, H.C. Chen, C.M. Wang, Albert T. Wu* (2017, Dec). Assessment of microstructure and shear strength for low melting point tin-free alloys on Cu. Materials Science and Engineering: A, 708, 142-148.
36. H.C. Hsieh, C.H. Wang, W.C. Lin, S. Chakroborty, T.H. Lee, H.S. Chu, Albert T. Wu* (2017, Dec). Electroless Co-P diffusion barrier for n-PbTe thermoelectric material. Journal of Alloys and Compounds, 728, 1023-1029.
37. Y.T. Huang, C.H. Chen, S. Chakroborty, Albert T. Wu* (2017, Sep). Crystallographic orientation effect on electromigration in Ni-Sn microbump. JOM, 69(9) 1717-1723.
38. B.C. Lin, C.S. Ku, H.Y. Lee, Albert T. Wu* (2017, Aug). Epitaxial growth of ZnO nanorod arrays via a self-assembled microspheres lithography. Applied Surface Science, 414, 212-217.
39. B.A. Williams, N.D. Trejo, Albert T. Wu, C.S. Holgate, L.F. Francis, E.S. Aydil (2017, Jun). Copper–zinc–tin–sulfide thin films via annealing of ultrasonic spray deposited nanocrystal coatings. ACS applied materials & interfaces, 9(22), 18865-18871.
40. P.C. Lin, H. Chen, H.C. Hsieh, Albert T. Wu* (2017, Feb). Effect of phase separation on mechanical strength of co-sputtering Cu(Ti) thin film in chip-level 3DIC bonding. Materials Letters, 189, 93-96.
41. Y.T. Huang, C.H. Chen, B.H. Lee, H.C. Chen, C.M. Wang, Albert T. Wu* (2016, Dec). In situ electromigration in Cu-Sn and Ni-Sn critical solder length for three-dimensional integrated circuits. Journal of Electronic Materials, 45(12), 6163-6170.
42. C.H. Chen, B.H. Lee, H.C. Chen, C.M. Wang, Albert T. Wu* (2016, Oct). Development of new low melting solder alloys. In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (pp. 2501-2506). IEEE.
43. T.H. Tseng, Albert T. Wu, Y.T. Chang, H.C. Shi, J. Lee (2016, Oct). Creep corrosion on high reliability printed circuit boards. In 2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (pp. 156-158). IEEE.
44. Y.T. Ouyang, H.C. Hsieh, P.C. Lin, T.H. Tseng, C.S. Ku, H.Y. Lee, Albert T. Wu* (2016, Aug). Si1-xGex photodiode with segregated Ge nanocrystals. Materials Letters, 184, 308-311.
45. H. Chen, Y.L. Tsai, Y.T. Chang, Albert T. Wu* (2016, Jun). Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes. Journal of Alloys and Compounds, 671, 100-108.
46. H.H. Hsu, C.M. Wang, H.Y. Lee, Albert T. Wu* (2016, Apr). Non-destructive testing method for chip warpage-Applications of synchrotron radiation X-ray. In 2016 International Conference on Electronics Packaging (ICEP) (pp. 15-18). IEEE.
47. H. Chen, H.Y. Lee, C.S. Ku, Albert T. Wu* (2016, Apr). Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures. Journal of Materials Science, 51(7), 3600-3606.
48. H.C. Huang*, K.L. Lin, Albert T. Wu (2016, Mar). Disruption of crystalline structure of Sn3.5Ag induced by electric current. Journal of Applied Physics, 119(11), 115102.
49. C.H. Chen, B.H. Lee, H.C. Chen, C.M. Wang, Albert T. Wu * (2016, Jan). Interfacial reactions of low-melting Sn-Bi-Ga solder alloy on Cu substrate. Journal of Electronic Materials, 45(1), 197-202.
50. Y.H. Liao, C.L. Liang, K.L. Lin*, Albert T. Wu (2015, Dec). High dislocation density of tin induced by electric current. AIP Advances, 5, 127210.
51. C.H. Huang, Y.L. Tsai, Y.T. Chang, Albert T. Wu* (2015, Oct). Massive spalling in Pb-free solder on co-based surface finishes. In 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (pp. 586-589). IEEE.
52. H.H. Hsu, H. Chen, Y.T. Ouyang, T.C. Chiu, T.C. Chang, H.Y. Lee, C.S. Ku, Albert T. Wu* (2015, Oct). In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded Substrates. Journal of Electronic Materials, 44, 3942-3947.
53. H.H. Hsu, Y.T. Huang, S.Y. Huang, T.C. Chang, Albert T. Wu* (2015, Jul). Evolution of the intermetallic compounds in Ni/Sn-2.5Ag/Ni microbumps for three-dimensional integrated circuits. Journal of Electronic Materials, 44(10), 3888-3895.
54. Y.T. Ouyang, C.H. Su, J.Y. Chang, S.L. Cheng, P.C. Lin, Albert T. Wu* (2015, May). Metastable Ge nanocrystalline in SiGe matrix for photodiode. Applied Surface Science, 349, 387-392.
55. J.Y. He, K.L. Lin*, Albert T. Wu (2015, Jan). The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing. Journal of Alloys and Compounds, 619, 372-377.
56. C.H. Su, H. Chen, H.Y. Lee, C.Y. Liu, C.S. Ku, Albert T. Wu* (2014, Sep). Kinetic analysis of spontaneous whisker growth on pre-treated surfaces with weak oxide. Journal of Electronic Materials, 43(9), 3290-3295.
57. C.Y. Liu*, Y.C. Hsu, Y.J. Hu, T.S. Huang, C.T. Lu, Albert T. Wu (2014, Jan). Back-fill Sn flux against current-stressing at cathode micro Cu/Sn interface. Journal of the Electrochemical Society, 3(2), 17-19.
58. H.H. Hsu, T.C. Chiu, T.C. Chang, S.Y. Huang, H.Y. Lee, C.S. Ku, Y.Y. Lin, C.H. Su, L.W. Chou, Y.T. Ouyang, Y.T. Huang, Albert T. Wu* (2014, Jan). Evaluation of strain measurement in a die-to-interposer chip using in situ synchrotron X-ray diffraction and finite-element analysis. Journal of Electronic Materials, 43(1), 52-56.
59. P.Y. Chien, C.H. Yeh, Albert T. Wu* (2014, Jan). Polarity effect in SAC305/bismuth telluride thermoelectric system. Journal of Electronic Materials, 43(1), 284-289.
60. Y.J. Hu, Y.C. Hsu, T.S. Huang, C.T. Lu, Albert T. Wu, C.Y. Liu* (2014, Jan). Effect of metal bond-pad configurations on the solder microstructure development of flip-chip solder joints. Journal of Electronic Materials, 43(1), 170-175.
61. Y.T. Huang, H.H. Hsu, Albert T. Wu* (2014, Jan). Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits. Journal of Applied Physics, 115(3), 034904.
62. C.Y. Liu, Y.C. Hsu, Y.J. Hu, T.S. Huang, C.T. Lu, Albert T. Wu* (2013, Dec). Back-fill Sn flux against current-stressing at cathode micro Cu/Sn interface. ECS Solid State Letters, 3(2), P17.
63. J.H. Hong, H.Y. Lee, Albert T. Wu* (2013, Dec). Massive spalling and morphological change of intermetallic compound affected by adding Pd in Co-based surface finishes. Journal of Alloys and Compounds, 580, 195-200.
64. L.W. Chou, Y.Y. Lin, Albert T. Wu* (2013, Jul). High surface textured SnO2 hybrid thin films fabricated using the nozzle-spraying process for solar cell applications. Applied Surface Science, 277, 30-34.
65. C.R. Kao*, Albert T. Wu, K.N. Tu, Y.S. Lai (2013, Jun). Reliability of micro-interconnects in 3D IC packages. Microelectonics Reliability, 53, 1-1.
66. Y.Y. Lin, H.Y. Lee, C.S. Ku, L.W. Chou, Albert T. Wu* (2013, Mar). Bandgap narrowing in high dopant tin oxide degenerate thin film produced by atmosphere pressure vapor deposition. Applied Physics Letter, 102(11), 111912.
67. W.Y. Chen, T.C. Chiu, K.L. Lin, Albert T. Wu, W.L. Jang, C.L. Dong, H.Y. Lee (2013, Feb). Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress. Scripta Materialia, 68, 317-320.
68. Y.T. Chiu, K.L. Lin*, Albert T. Wu, W.L. Jang, C.L. Dong, Y.S. Laid (2013, Feb). Electrorecrystallization of metal alloy. Journal of Alloys and Compounds, 549, 190-194.
69. C.Y. Ko, Albert T. Wu, T.Y. Lin (2012) Evaluation of Diffusion Barrier between SAC 305 and Tellurium. In AIP Conference Proceedings. American Institute of Physics, Ste. 1 NO 1 Melville NY 11747-4502 United States.
70. C.Y. Ko, Albert T. Wu* (2012, Dec). Evaluation of diffusion barrier between pure Sn and Te. Journal of Electronic Materials, 41(12), 3320-3324.
71. L.C. Lo, Albert T. Wu* (2012, Dec). Interfacial reactions between diffusion barriers and thermoelectric materials under current stressing. Journal of Electronic Materials, 41(12), 3325-3330.
72. Y.Y. Lin, Albert T. Wu*, C.S. Ku, H.Y. Lee (2012, Oct). Analysis of chlorine ions in antimony-doped tin oxide thin film using synchrotron grazing incidence X-ray diffraction. Japanese Journal of Applied Physics, 51(10), 10NE28.
73. C.N. Yeh, K.W. Yang, H.Y. Lee, Albert T. Wu* (2012, Jan). Elucidating the metal-induced crystallization and diffusion behavior of Al/a-Ge thin films. Journal of Electronic Materials, 41(1), 159-165.
74. C.Y. Tsai, B.Y. Lou, H.H. Hsu, Albert T. Wu* (2012, Jan). Current redistribution by intermetallic compounds in through-silicon-via (TSV). Materials Chemistry and Physics, 132(1), 162-165.
75. T.Y. Lin, C.N. Liao, Albert T. Wu* (2012, Jan). Evaluation of diffusion barrier between lead-free solder systems and thermoelectric materials. Journal of Electronic Materials, 41(1), 153-158.
76. L.C. Lo, Albert T. Wu, T.Y. Lin (2012). The Interfacial Reaction between Diffusion Barrier and Thermoelectric Materials under Current. In AIP Conference Proceedings. American Institute of Physics, Ste. 1 NO 1 Melville NY 11747-4502 United States.
77. H.H. Hsu, S.Y. Huang, T.C. Chang, Albert T. Wu* (2011, Dec). Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits. Applied Physics Letters, 99(25), 251913.
78. Y.Y. Lin, Albert T. Wu, C.S. Ku, H.Y. Lee (2011, Jun). Analysis of antimony doped SnO2 thin film by synchrotron grazing incidence X-Ray diffraction. In 2011 37th IEEE Photovoltaic Specialists Conference (pp. 001768-001770). IEEE.
79. C.H. Su, H. Chen, H.Y. Lee, Albert T. Wu* (2011, Sep). Controlled positions and kinetic analysis of spontaneous tin whisker growth. Applied Physics Letters, 99(13), 131906.
80. C.H. Chen, S.Y. Li, A.S.T. Chiang*, Albert T. Wu, Y.S. Sun (2011, Jul). Scratch-resistant zeolite anti-reflective coating on glass for solar applications. Solar Energy Materials & Solars Cells, 95(7), 1694-1700.
81. F. Hua, Albert T. Wu, K. Jeng, K. Seshan (2011, Jun). Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same. U.S. Patent No. 7,960,831. Washington, DC: U.S. Patent and Trademark Office.
82. J.O. Sun, K.N. Tu, Albert T. Wu, N. Tamura (2011, Jun). Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPd on Ni. Journal of Applied Physics, 109(12), 123513.
83. C.N. Yeh, K. Yung, Albert T. Wu* (2011). Interdiffusion of Aluminum/Germanium Bi-Layer Thin Film. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 United States.[np]. Feb.
84. C.N. Yeh, K. Yang, Albert T. Wu* (2011). Metal-Induced Crystallization and the Diffusion Behavior of Al/Ge Thin Film. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 United States.[np]. Feb.
85. Y.Y. Lin, Albert T. Wu* (2011). The Investigation of Chemical Vapor Deposited Antimony Doped SnO 2 Thin Films by Synchrotron Grazing Incidence X-Ray. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 United States.[np]. Feb.
86. T.Y. Lin, C.N. Liao, Albert T. Wu* (2011). Formation of Intermetallic Compounds between Lead-free Solder Systems and Thermoelectric Materials. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 United States.[np]. Feb.
87. H.H. Hsu, T.C. Chang, C. Chen, H.Y. Lee, Albert T. Wu* (2010, Oct). Electrical current induced local thermal stress caused on stacked 3D-ICs. In 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (pp. 1-2). IEEE.
88. H.H. Hsu, T.C. Chang, C. Chen, H.Y. Lee, Albert T. Wu* (2010, Oct). The in-situ measurement of thermal stress on stacked 3D-IC by utilizing synchrotron radiation X-ray. In 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference (pp. 1-2). IEEE.
89. Y.Y. Chiang, R. Cheng, Albert T. Wu* (2010, Nov). Effects on undercooling and interfacial reactions with Cu substrates of adding Bi and In to Sn-3Ag solder. Journal of electronic materials, 39(11), 2397-2402.
90. Albert T. Wu*, C.N. Siao, C.S. Ku, H.Y. Lee (2010, Feb). In situ observation of stress evolution in pure tin strip under electromigration using synchrotron radiation x-ray. Journal of Materials Research, 25(2), 292-295.
91. Y.Y. Lin, Albert T. Wu* (2010). Direct Measurement of Back Stress Un Tin Strips under Electromigration by Synchrotron Radiation X-ray. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 USA.[np]. 14-18 Feb.
92. C.H. Su, Albert T. Wu* (2010). Mitigation of the Growth of Tin Whiskers by Surface Treatments. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 USA.[np]. 14-18 Feb
93. Y.Y. Chiang, Albert T. Wu* (2010). The Interfacial Reactions of Snagin Pb-Free Solders on Cu Substrates. Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box 430 Warrendale PA 15086 USA.[np]. 14-18 Feb
94. S.K. Kang, I. Anderson, S. Chada, J.G. Duh, L.J. Turbini, Albert T. Wu, C.R. Kao, F. Hua, KN Subramanian, D. Frear, C. Handwerker, F. Guo, N. Chawla, K. Zeng (2009, Dec). Journal of Electronic Materials: Foreword. Journal of Electronic Materials, 38(12), 2427-2428.
95. Albert T. Wu*, K.H. Sun (2009, Dec). Determination of average failure time and microstructural analysis of Sn-Ag-Bi-In solder under electromigration. Journal of Electronic Materials, 38(12), 2780-2785.
96. Albert T. Wu*, C.Y. Tsai, C.L. Kao, M.K. Shih, Y.S. Lai, H.Y. Lee, C.S. Ku (2009, Nov). In situ measurements of thermal and electrical effects of strain in flip-chip silicon dies using synchrotron radiation X-rays. Journal of Electronic Materials, 38(11), 2308-2313.
97. Albert T. Wu*, M.H. Chen, C.H. Huang (2009, May). Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates. Journal of Alloys and Compounds, 476(1-2), 436-440.
98. Albert T. Wu*, Y.C. Ding (2009, Mar). The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment. Microelectronics Reliability, 49(3), 318-322.
99. Albert T. Wu*, M.H. Chen, C.N. Siao (2009, Feb). The effect of solid state aging on the intermetallic compounds of Sn-Ag-Bi-In solders on Cu substrates. Journal of Electronic Materials, 38(2), 252-256.
100. M.H. Chen, Y.Y. Jieng, Albert T. Wu* (2008, Oct). The composition of intermetallic compounds in Sn-Ag-Bi-In solders on Cu substrates. In 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference (pp. 209-211). IEEE.
101. F. Hua, Albert T. Wu, K. Jeng, K. Seshan (2008, Jan). Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same. U.S. Patent No. 7,314,819. Washington, DC: U.S. Patent and Trademark Office.
102. Albert T. Wu*, Y.C. Hsieh (2008, Mar). Direct observation and kinetic analysis of grain rotation in anisotropic tin under electromigration. Applied Physics Letters, 92(12), 121921.
103. W.H. Lin, Albert T. Wu, S.Z. Lin, T.H. Chuang, K.N. Tu (2007, Jul). Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads. Journal of Electronic Materials, 36(7), 753-759.
104. Albert T. Wu*, F. Hua (2007, Mar). Interfacial stability of eutectic SnPb solder and composite 60Pb40Sn solder on Cu/Ni(V)/Ti under bump metallization. Journal of Materials Research, Volume: 22 Issue: 3 Pages: 735-741.
105. K.N.Tu*, C. Chen, Albert T. Wu (2007, Mar). Stress analysis of spontaneous Sn whisker growth. Journal of Materials Science: Materials in Electronics, 18(1-3), 269-281.
106. K.N. Tu*, J.O. Suh, Albert T. Wu, N. Tamura, C.H. Tung (2005, Nov). Mechanism and prevention of spontaneous tin whisker growth. Materials Transactions, 46(11), 2300-2308.
107. Albert T. Wu, A.M. Gusak, K.N. Tu, C.R. Kao (2005, Jun). Electromigration induced grain rotation in anisotropic conducting beta-tin. Applied Physics Letters, 86, 241902.
108. Albert T. Wu, N. Tamura, J.R. Lloyd, C.R. Kao, K.N. Tu (2005, Jan). Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigration. MRS Online Proceedings Library (OPL), 863, B9-10.
109. Albert T. Wu*, K.N. Tu, J.R. Lloyd, N. Tamura, B.C. Valek, C.R. Kao (2005, Jan). Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction. TMS Letters, 1(8), 165-166.
110. Albert T. Wu, K.N. Tu, J.R. Lloyd, N. Tamura, B.C. Valek, C.R. Kao (2004, Sep). Electromigration-induced microstructure evolution in tin studied by synchrotron X-ray microdiffraction. Applied Physics Letters, 85, 2490.